Applications
- Cutting materials - metal shims, glasses and even organic materials
- Cutting and drilling in flex circuits.
- Other PCB and device laser processing
Specifications and Features
- 355 nm, 20 um diameter, focused beam at the substrate
- 350 x 350 x 11 mm working area (XYZ)
- +/- 25 um positioning accuracy
- Custom recipes (known as "tools") for your specific material application
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